Fujikura Printed Circuits will exhibit at the 10th Wearable EXPO

Fujikura Printed Circuits Ltd. in collaboration with its subsidiary Fujikura Corporation, will be exhibiting at the 10th Wearable EXPO, which will be held at Tokyo Big Sight from January 24th to 26th, 2024.
At our booth, we will be introducing the following products that are optimized for wearable devices, with a focus on keywords such as high density, fine pitch, high-speed transmission, high assembly capability, and compactness.
We look forward to your visit.

Main Exhibits

Product	Key Highlights
High-density wiring FPC	This is a Fine Pitch Circuit (FPC) that is essential for wearable products such as AR/VR displays. It is manufactured using a semi-additive process where circuits and through-holes are simultaneously plated on a film, achieving a narrow pitch of L/S=20μm/20μm.
Impedance control FPC	We offer FPC structure and circuit design proposals based on impedance simulation, as well as a total solution incorporating feedback from impedance measurement values. Multilayer High-flexibility FPC Introducing the multi-layer hollow FPC, which incorporates a hollow structure in the bending area to enhance embeddability and flexibility.
Multilayer High-flexibility FPC	Introducing the multi-layer hollow FPC, which incorporates a hollow structure in the bending area to enhance embeddability and flexibility.

Exhibition Overview

• Date：January 24th (Thursday) to 26th (Friday), 2024
• Time：10:00 AM to 5:00 PM
• Venue：Tokyo Big Sight, West Exhibition Hall 4F
• Fujikura Booth：No. W66-66
• Official Website of the 10th Wearable EXPO：
  https://www.wearable-expo.jp/ja-jp.html

  
  

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